Cerca de la Lakefield: el chip de Intel con el galardonado Foveros 3D Tech (English Only)

Intel Images: Intel Lakefield with Foveros Technology The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a … Continued

The post Cerca de la Lakefield: el chip de Intel con el galardonado Foveros 3D Tech (English Only) appeared first on Intel Latinoamérica Newsroom.



via Intel.

Entradas populares de este blog

Arreglando los foquitos de Navidad

¿Cuáles son los componentes básicos de la materia?

Este sitio usa imágenes de Depositphotos