El diminuto Intel EMIB ayuda a los chips a “hablar” entre ellos (English Only)
Most chips in today’s smartphones, computers and servers are comprised of multiple smaller chips invisibly sealed inside one rectangular package. How do these multiple chips — often including CPU, graphics, memory, IO and more — communicate? An Intel innovation called EMIB (embedded multi-die interconnect bridge) is a complex multi-layered sliver of silicon no bigger … Continued
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via Intel.
